advanced power p-channel enhancement mode electronics corp. power mosfet simple drive requirement bv dss -40v low on-resistance r ds(on) 50m fast switching characteristic i d -6a description absolute maximum ratings symbol units v ds v v gs v i d @t a =25 a i d @t a =70 a i dm a p d @t a =25 w w/ t stg t j symbol value unit rthj-a thermal resistance junction-ambient 3 max. 50 /w data and specifications subject to change without notice 201223041 ap9567gm rating -40 25 -6 parameter drain-source voltage gate-source voltage continuous drain current 3 storage temperature range continuous drain current 3 -4.8 pulsed drain current 1 -30 0.02 pb free plating product thermal data parameter total power dissipation 2.5 -55 to 150 operating junction temperature range -55 to 150 linear derating factor the advanced power mosfets from apec provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness. the so-8 package is universally preferred for all commercial-industrial surface mount applications and suited for low voltage applications such as dc/dc converters. s s s g d d d d so-8 g d s
electrical characteristics@t j =25 o c(unless otherwise specified) symbol parameter test conditions min. typ. max. units bv dss drain-source breakdown voltage v gs =0v, i d =-250ua -40 - - v b v dss / t j breakdown voltage temperature coefficient reference to 25 , i d =-1ma - -0.03 - v/ r ds(on) static drain-source on-resistance 2 v gs =-10v, i d =-6a - - 50 m v gs =-4.5v, i d =-4a - - 80 m v gs(th) gate threshold voltage v ds =v gs , i d =-250ua -1 - -3 v g fs forward transconductance v ds =-10v, i d =-6a - 9 - s i dss drain-source leakage current (t j =25 o c) v ds =-40v, v gs =0v - - -1 ua drain-source leakage current (t j =70 o c) v ds =-32v, v gs =0v - - -25 ua i gss gate-source leakage v gs =25v - - na q g total gate charge 2 i d =-6a - 11 18 nc q gs gate-source charge v ds =-32v - 3 - nc q gd gate-drain ("miller") charge v gs =-4.5v - 5 - nc t d(on) turn-on delay time 2 v ds =-20v - 10 - ns t r rise time i d =-1a - 5 - ns t d(off) turn-off delay time r g =3.3 , v gs =-10v - 30 - ns t f fall time r d =20 -6- ns c iss input capacitance v gs =0v - 880 1400 pf c oss output capacitance v ds =-25v - 135 pf c rss reverse transfer capacitance f=1.0mhz - 110 - pf r g gate resistance f=1.0mhz - 5 8 source-drain diode symbol parameter test conditions min. typ. max. units v sd forward on voltage 2 i s =-2a, v gs =0v - - -1.2 v t rr reverse recovery time 2 i s =-6a, v gs =0 v , - 24 - ns q rr reverse recovery charge di/dt=100a/s - 21 - nc notes: 1.pulse width limited by max. junction temperature. 2.pulse width < 300us , duty cycle < 2%. 3.surface mounted on 1 in 2 copper pad of fr4 board, t < 10sec ; 125 /w when mounted on min. copper pad. ap9567gm 100
ap9567gm fig 1. typical output characteristics fig 2. typical output characteristics fig 3. on-resistance v.s. gate voltage fig 4. normalized on-resistance v.s. junction temperature fig 5. forward characteristic of fig 6. gate threshold voltage v.s. reverse diode junction temperature 0 10 20 30 40 50 02468 -v ds , drain-to-source voltage (v) -i d , drain current (a) t a =25 o c -10v -7.0v - 5.0v -4.5v v g = -3.0 v 0 10 20 30 40 50 02468 -v ds , drain-to-source voltage (v) -i d , drain current (a) t a =150 o c -10v -7.0v - 5.0v -4.5v v g = -3.0 v 35 45 55 65 246810 -v gs , gate-to-source voltage (v) r ds(on) (m ) i d =-4a t a =25 0.4 0.8 1.2 1.6 -50 0 50 100 150 t j , junction temperature ( o c) normalized r ds(on) i d =-6a v g =-10v 0 2 4 6 0 0.2 0.4 0.6 0.8 1 1.2 1.4 -v sd , source-to-drain voltage (v) -i s (a) t j =25 o c t j =150 o c 0.2 0.7 1.2 1.7 -50 0 50 100 150 t j , junction temperature ( o c) normalized -v gs(th) (v)
fig 7. gate charge characteristics fig 8. typical capacitance characteristics fig 9. maximum safe operating area fig 10. effective transient thermal impedance fig 11. transfer characteristics fig 12. gate charge waveform ap9567gm q v g -4.5v q gs q gd q g charge 100 1000 10000 1 5 9 13 17 21 25 29 -v ds , drain-to-source voltage (v) c (pf) f =1.0mhz c iss c oss c rss 0 2 4 6 8 10 12 0 5 10 15 20 25 q g , total gate charge (nc) -v gs , gate to source voltage (v) i d = -6a v ds = -32v 0.01 0.1 1 10 100 0.1 1 10 100 -v ds , drain-to-source voltage (v) -i d (a) t a =25 o c single pulse 1ms 10ms 100ms 1s dc 0.001 0.01 0.1 1 0.0001 0.001 0.01 0.1 1 10 100 1000 t , pulse width (s) normalized thermal response (r thja ) p dm duty factor = t/t peak t j = p dm x r thja + t a r thja =125 o c/w t t 0.02 0.01 0.05 0.1 0.2 duty factor=0.5 single pulse 0 10 20 30 02468 -v gs , gate-to-source voltage (v) -i d , drain current (a) t j =150 o c t j =25 o c v ds =-5v
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